Korea JoongAng Daily on MSN

LG Innotek develops next-gen substrate for smart cards, cuts carbon emission by half

LG Innotek has developed a next-generation smart IC (integrated circuit) substrate, a core component in smart cards, that ...
The Chosun Ilbo on MSN

LG Innotek’s smart IC substrate halves carbon emissions, boosts durability

LG Innotek announced on the 10th that it has successfully developed a ‘next-generation smart IC (integrated circuit) ...
TMCnet

SEALSQ Enters the Healthcare Industry Through IC'Alps, Delivering Custom Integrated Chip Solutions and Post-Quantum Protection for Next-Generation Medical Devices

By combining SEALSQ’s world-leading expertise in post-quantum cybersecurity and secure semiconductors with IC’Alps’ mastery in medical ASIC design, SEALSQ enters the healthcare industry with a highly ...
Semiconductor Engineering

Transformation Of 2D-ICs Into 3D-ICs Using Shuttle Chips From Multi-Project Wafers (Tohoku University)

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

Kerala college joins India’s push for self-reliance in chip production

THIRUVANANTHAPURAM: As part of initiatives to achieve self reliance in the semiconductor sector, two application-specific integrated circuit (IC) chips designed ...
Electronics Weekly

Toshiba launches cost-effective gate driver IC for three-phase BLDC motors

Toshiba is sampling a gate driver IC tailored for three-phase brushless DC (BLDC) motors for functions like power sliding ...